Hi! I currently run a class 10k (Iso 7) cleanroom for the purpose of die placement, gold wirebonding and encapsulation on PCBs. My device suppliers recommend a Class 1k (ISO6) for their devices – I’m considering upgrading but I am struggling to find any quantifiable explanations on what the improvement will be. Some places say it is only relevant for yield, but what about long term contamination due to corrosive particulates? Has anyone got any good data/info/papers?

Thanks!
R